HEAT SINK FOR ELECTRONIC EQUIPMENT

PROBLEM TO BE SOLVED: To provide a heat sink for an electronic equipment suitable for assembling a large power module having excellent heat dissipating characteristics and capable of enhancing adhesive properties with a counterparty material. SOLUTION: The heat sink of the electronic equipment compr...

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Bibliographic Details
Main Authors KAWANO MASATO, KAWASAKI TAKU, OTSUKA TETSUMI
Format Patent
LanguageEnglish
Published 27.09.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a heat sink for an electronic equipment suitable for assembling a large power module having excellent heat dissipating characteristics and capable of enhancing adhesive properties with a counterparty material. SOLUTION: The heat sink of the electronic equipment comprises a heat change type composition solidified layer containing a thermally conductive filler, a wax and/or a paraffin and a thermoplastic resin to be softened at 40 to 100 deg.C and formed on at least one surface of a ceramic insulating plate having a withstand voltage of 10 kV/mm or more.
Bibliography:Application Number: JP20010073563