APPARATUS FOR TREATING SUBSTRATE

• Main Authors: TATENO HIDETO, YANAGAWA HIDEHIRO, HOSAKA EIJI
• Format: Patent
• Language: English
• Published: 20.09.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To improve handling performance by improving the method for securing a protective tube inserted with a temperature measuring means. SOLUTION: The apparatus for treating a substrate comprises means 13 for holding the substrate 12, a treating container 5 being loaded with the holding means, a heater unit 2 surrounding the treating container, and means 10 for measuring the temperature in the treating container. The substrate treating system treats the substrate by introducing a treating gas into the treating container and heating the substrate up to a given temperature wherein the temperature measuring means is loaded into the protective tube 9 bonded to the treating container.