QUALITY CONTROL SYSTEM FOR BONDED WOOD

PROBLEM TO BE SOLVED: To surely prevent shipment of a defective product having bonding defects. SOLUTION: A pipe 3 is arranged on a board 1 becoming a material for bonded wood. An adhesive agent 4 flows down from a nozzle 3A of the pipe 3 and is applied onto the board 1. The board 1 is carried in th...

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Bibliographic Details
Main Authors NAMITA KENJI, KATO SHIGERU
Format Patent
LanguageEnglish
Published 03.09.2002
Edition7
Subjects
NAILING OR STAPLING MACHINES IN GENERAL
PERFORMING OPERATIONS
TRANSPORTING
WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL
WORKING VENEER OR PLYWOOD
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Summary:PROBLEM TO BE SOLVED: To surely prevent shipment of a defective product having bonding defects. SOLUTION: A pipe 3 is arranged on a board 1 becoming a material for bonded wood. An adhesive agent 4 flows down from a nozzle 3A of the pipe 3 and is applied onto the board 1. The board 1 is carried in the arrow 2 direction. The adhesive agent 4 is applied in a specific thickness string shape onto the board 1. An optical sensor 11 images a state of the adhesive agent 4 which is applied in a string-like parallel onto the board 1. An optical sensor 12 images the state of the adhesive agent 4 near the nozzle 3A making the adhesive agent 4 flow down in a shower state. In a case where incorrectness of control for thickness is detected, a mark indicating it is put on the product.
Bibliography:Application Number: JP20010049782