MOLDING AND PACKAGE FOR PHOTOSENSITIVE MATERIAL
PROBLEM TO BE SOLVED: To enhance the performances of a molding and a package for a photosensitive material using paper-resin, to diminish factors having adverse effects particularly on photographic properties, and to provide a molding and a package for a photosensitive material whose mechanical perf...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
30.08.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To enhance the performances of a molding and a package for a photosensitive material using paper-resin, to diminish factors having adverse effects particularly on photographic properties, and to provide a molding and a package for a photosensitive material whose mechanical performance is comparable to that of a molding of 100% thermoplastic resin. SOLUTION: Waterproof paper for photographic printing paper obtained by coating base paper made for photographic printing paper with a polyolefin resin is cut into pieces to prepare a mixture of cellulose fibers and the polyolefin resin, another thermoplastic resin is added to the mixture if necessary and the objective molding for a photosensitive material containing the base paper and the polyolefin resin molded in such a way that the weight ratio of the polyolefin resin and the another thermoplastic resin to the cellulose fibers originating from the base paper ranges from (51:49) to (75:25) is obtained. |
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Bibliography: | Application Number: JP20010329218 |