HEAT CONDUCTIVE RESIN FORMATION AND ITS USE

PROBLEM TO BE SOLVED: To provide a heat conductive resin formation and a heat dissipation member for further improving heat-dissipation characteristic in an electronic apparatus. SOLUTION: A heat conductive resin formation is composed of a plurality of skeletal parts (2), made of heat conductive res...

Full description

Saved in:
Bibliographic Details
Main Authors ITABASHI YASUHIKO, KAWASAKI TAKU, OTSUKA TETSUMI
Format Patent
LanguageEnglish
Published 23.08.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a heat conductive resin formation and a heat dissipation member for further improving heat-dissipation characteristic in an electronic apparatus. SOLUTION: A heat conductive resin formation is composed of a plurality of skeletal parts (2), made of heat conductive resin hardening material and a resin part (3), with which part of or all of the follow part formed by the skeletal parts (2) is filled. The skeletal part (2) has Asker C hardness of 55 or below, and the heat dissipation member is made of this heat conductive resin formation.
Bibliography:Application Number: JP20010030737