POSITIVE TYPE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION

• Main Authors: MIYOSHI KAZUTO, TOMIKAWA MASAO, SUWA MITSUFUMI
• Format: Patent
• Language: English
• Published: 09.08.2002
• Edition: 7
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin precursor composition enabling alkali development. SOLUTION: The positive type photosensitive resin precursor composition is characterized by containing (a) a polyamide acid ester having at least any one group selected among a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group on the end of polymer main chain, (b) a compound having the phenolic hydroxyl group, and (c) an esterified quinone diazido compound.