POLYIMIDE RESIN COMPOSITION AND SEMICONDUCTIVE BELT

PROBLEM TO BE SOLVED: To provide a polyimide resin composition having high mechanical characteristics and small variations of electrical resistance, reduced in deterioration in resistance with the lapse of time caused by electrical loads and the like and exhibiting semiconductive properties, and a s...

Full description

Saved in:
Bibliographic Details
Main Authors KAMIBAYASHI MASAHIRO, OTA YOSHIO, TOMITA TOSHIHIKO, ISHIZAKI SATORU
Format Patent
LanguageEnglish
Published 31.07.2002
Edition7
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
ELECTRICITY
ELECTROGRAPHY
ELECTROPHOTOGRAPHY
GENERAL PROCESSES OF COMPOUNDING
HOLOGRAPHY
INSULATORS
MAGNETOGRAPHY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PHOTOGRAPHY
PHYSICS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a polyimide resin composition having high mechanical characteristics and small variations of electrical resistance, reduced in deterioration in resistance with the lapse of time caused by electrical loads and the like and exhibiting semiconductive properties, and a semiconductive belt composed of the polyimide resin composition. SOLUTION: The polyimide resin composition is composed mainly of a polyimide resin comprising a carbon black, has a residual radical amount per unit weight of at most 2×1018 spin/g and a surface resistivity in terms of the common logarithm of 8-14 logΩ/(square). The semiconductive belt is composed of the polyimide resin composition.
Bibliography:Application Number: JP20010008441