ELECTRONIC COMPONENT PROVIDED WITH BUMP

PROBLEM TO BE SOLVED: To provide a bump constitution, capable of being jointed using low pressure, while preventing oxidation of Sn prior to jointing, in an electronic component provided with an electrode and a bump containing Sn to be fused so as to be jointed with a mating member formed on the sur...

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Bibliographic Details
Main Author NIIMI AKIHIRO
Format Patent
LanguageEnglish
Published 05.07.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a bump constitution, capable of being jointed using low pressure, while preventing oxidation of Sn prior to jointing, in an electronic component provided with an electrode and a bump containing Sn to be fused so as to be jointed with a mating member formed on the surface of the electrode. SOLUTION: For the bump 30 provided on an IC chip 10 as an electronic component, a diffusion preventing layer 31, a first layer 33 composed of Sn and a second layer 34 as the uppermost surface layer composed of Ag or Au are successively laminated starting from the side of the electrode 14. The weight ratio of the first layer 33 and the second layer 34 is set so as to be the eutectic composition of metals which constitutes the first and second layers 33 and 34, when the bump 30 is fused.
Bibliography:Application Number: JP20000387621