SUBSTRATE AND SEMICONDUCTOR PACKAGE USING IT

PROBLEM TO BE SOLVED: To provide a substrate which can exceedingly suppress the disconnection of wiring caused by the cracking of a solder resist, and to provide a semiconductor package using the substrate. SOLUTION: The substrate has terminals for connecting solder balls. The wiring connected to th...

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Bibliographic Details
Main Authors KAWAKAMI YUTAKA, INOUE FUMIO, SHIMIZU AKIRA, NAMATAME KAZUHIKO, AWANO YASUHIKO
Format Patent
LanguageEnglish
Published 28.06.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a substrate which can exceedingly suppress the disconnection of wiring caused by the cracking of a solder resist, and to provide a semiconductor package using the substrate. SOLUTION: The substrate has terminals for connecting solder balls. The wiring connected to the terminals has a width of <=100 μm, and a solder resist covering the wiring has modulus of elasticity of 2-3 GPa. In the semiconductor package, a semiconductor chip is mounted on the substrate.
Bibliography:Application Number: JP20000383813