FILM FORMING APPARATUS

• Main Authors: NOSE KOICHI, MINEMURA TETSUO, IHARA YASUSHI, TAKIGAWA SHIRO, KAMIYA KAZUO, TOKOMOTO ISAO, KIZAWA KENICHI, KATO AKIRA, KAJIYAMA HIROSHI, KOIZUMI YASUHIRO
• Format: Patent
• Language: English
• Published: 26.06.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THEIR RELEVANT APPARATUS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a film forming apparatus capable of maintaining a vacuum degree without requiring an evacuation apparatus of a large capacity and efficiently generating a reaction on a substrate surface to conduct film forming. SOLUTION: The apparatus is provided with a vacuum container 2, a gas filling apparatus 4, an evacuating apparatus 4 and a substrate holder 5 having an electrode function to generate a high frequency electric field producing plasma in the vacuum container 2, the gas filling apparatus 3 has a gas beam injector 14 by which the gas having a speed component of a prescribed direction among supplied gases is selected and guided into the vacuum container 2, the gas beam injector 14 is mounted in the vacuum container 2 so that the prescribed direction is directed to a film forming objective face of a substrate W mounted in the vacuum container 2, the gas beam injector 14 is constituted as freely oscillated so that the injection gas can scan the surface of the substrate W.