PAD CONDITIONER

• Main Authors: ASAHINO HAJIME, KADOMURA KAZUNORI, FUKUSHIMA KENJI
• Format: Patent
• Language: English
• Published: 18.06.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a pad conditioner of a CMP device used in working a semiconductor substrate, capable of improving the working efficiency, and preventing the dropping of diamond abrasive grain and breaking by micron, of a cutting edge. SOLUTION: The diamond abrasive grain is uniformly dispersed and fixed in a state that a ratio occupied by projection area of the diamond abrasive grain to a surface area of a base metal is 30-80%. A projecting amount of the diamond abrasive grain from a plating layer is 3% or more to 50% or less, and the diamond abrasive grain preferably has a crystalline face of the blocky crystalline configuration of hexahedron and octahedron composed of [111] faces and [100] faces.