PAD CONDITIONER

PROBLEM TO BE SOLVED: To provide a pad conditioner of a CMP device used in working a semiconductor substrate, capable of improving the working efficiency, and preventing the dropping of diamond abrasive grain and breaking by micron, of a cutting edge. SOLUTION: The diamond abrasive grain is uniforml...

Full description

Saved in:
Bibliographic Details
Main Authors ASAHINO HAJIME, KADOMURA KAZUNORI, FUKUSHIMA KENJI
Format Patent
LanguageEnglish
Published 18.06.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a pad conditioner of a CMP device used in working a semiconductor substrate, capable of improving the working efficiency, and preventing the dropping of diamond abrasive grain and breaking by micron, of a cutting edge. SOLUTION: The diamond abrasive grain is uniformly dispersed and fixed in a state that a ratio occupied by projection area of the diamond abrasive grain to a surface area of a base metal is 30-80%. A projecting amount of the diamond abrasive grain from a plating layer is 3% or more to 50% or less, and the diamond abrasive grain preferably has a crystalline face of the blocky crystalline configuration of hexahedron and octahedron composed of [111] faces and [100] faces.
Bibliography:Application Number: JP20000374412