CIRCUIT BOARD

PROBLEM TO BE SOLVED: To save labor and time of designing and manufacturing a plurality of circuit boards. SOLUTION: Circuit patterns 31-35 are printed on a dielectric substrate 51, so that a SAW filter and a dielectric filter are mounted alternately on the dielectric substrate 51. Cutouts 41-44 are...

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Bibliographic Details
Main Author ARAKAWA TAKASHI
Format Patent
LanguageEnglish
Published 14.06.2002
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To save labor and time of designing and manufacturing a plurality of circuit boards. SOLUTION: Circuit patterns 31-35 are printed on a dielectric substrate 51, so that a SAW filter and a dielectric filter are mounted alternately on the dielectric substrate 51. Cutouts 41-44 are formed which can be selectively connected by soldering. When the SAW filter is mounted, the cutouts 41 and 43 are soldered to connect a land 9 and the circuit patterns 31, 33, and 35. When the dielectric filter is mounted, the cutouts 42 and 44 are soldered to connect the land 9 and the circuit patterns 32, 34, and 35.
Bibliography:Application Number: JP20000366304