METHOD AND DEVICE FOR WET CLEANING OF SUBSTRATE

PROBLEM TO BE SOLVED: To realize a uniform, stabilized cleaning treatment in a wet cleaning technique for a substrate using an aqueous cleaning liquid of hydrofluoric acid as an effective component by suppressing the increase of hydrogen fluoride(HF) concentration in the cleaning liquid which occurs...

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Bibliographic Details
Main Author INAGAKI YASUSHI
Format Patent
LanguageEnglish
Published 11.06.2002
Edition7
Subjects
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
BASIC ELECTRIC ELEMENTS
CANDLES
CHEMISTRY
CLEANING
CLEANING IN GENERAL
DETERGENT COMPOSITIONS
DETERGENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FATTY ACIDS THEREFROM
METALLURGY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
RECOVERY OF GLYCEROL
RESIN SOAPS
SEMICONDUCTOR DEVICES
SOAP OR SOAP-MAKING
TRANSPORTING
USE OF SINGLE SUBSTANCES AS DETERGENTS
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Summary:PROBLEM TO BE SOLVED: To realize a uniform, stabilized cleaning treatment in a wet cleaning technique for a substrate using an aqueous cleaning liquid of hydrofluoric acid as an effective component by suppressing the increase of hydrogen fluoride(HF) concentration in the cleaning liquid which occurs with processing of cleaning time. SOLUTION: In a method wherein a silicon substrate with a silicon oxide film formed thereon is dipped in a cleaning liquid and subjected to etching cleaning, the increase of hydrofluoric acid concentration in the cleaning liquid which occurs with proceeding of the cleaning time is suppressed by intermittently supplying a proper amount of the cleaning liquid in an SC-1 tank 11 to a BHF tank (cleaning tank) 15 where a mixed aqueous solution of ammonium fluoride and hydrofluoric acid is stored as a cleaning liquid, as a diluting liquid therefor. As a diluting liquid, pure water (ion-exchanged water) in a rinsing tank 17, isopropyl alcohol(IPA) liquid in a drying tank 18, or the like, may be used.
Bibliography:Application Number: JP20000363155