COVER TAPE

PROBLEM TO BE SOLVED: To provide a cover tape with low dependence on a heat-sealing temperature and whose peeling strength can be easily adjusted, and to provide a carrier tape body comprising the cover tape. SOLUTION: The cover tape includes a biaxially oriented film layer, an intermediate layer of...

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Bibliographic Details
Main Authors HIGANO MASANORI, KOSUGI KAZUHIRO
Format Patent
LanguageEnglish
Published 28.05.2002
Edition7
Subjects
ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
GENERAL PROCESSES OF COMPOUNDING
HANDLING THIN OR FILAMENTARY MATERIAL
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
STORING
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a cover tape with low dependence on a heat-sealing temperature and whose peeling strength can be easily adjusted, and to provide a carrier tape body comprising the cover tape. SOLUTION: The cover tape includes a biaxially oriented film layer, an intermediate layer of a polyolefin based resin and a heat seal layer of an ethylene-vinyl acetate based copolymer wherein a thickness of the heat seal layer is 2 μm or more, and the cover tape has a modulus in tension of 1,100 to 1,900 Mpa and a thickness of 70 μm or less.
Bibliography:Application Number: JP20000350420