METHOD AND APPARATUS FOR CLEANING SUBSTRATE

PROBLEM TO BE SOLVED: To uniformly and stably clean a substrate, to save resources, and to reduce waste. SOLUTION: When the substrate is cleaned by using a cleaning solution of an aqueous solution containing ammonium fluoride and hydrogen fluoride in a ratio of ammonium fluoride (wt.%) to hydrogen f...

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Bibliographic Details
Main Author INAGAKI YASUSHI
Format Patent
LanguageEnglish
Published 21.05.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To uniformly and stably clean a substrate, to save resources, and to reduce waste. SOLUTION: When the substrate is cleaned by using a cleaning solution of an aqueous solution containing ammonium fluoride and hydrogen fluoride in a ratio of ammonium fluoride (wt.%) to hydrogen fluoride (wt.%) <=50, water is added into the cleaning solution with the passage of time during the cleaning. The ratio changes generally during the cleaning, and the change depends on the ratio. When the ratio is 50 or below, almost no change in the ratio is observed. Accordingly, the concentration of the fluorides in the cleaning solution can be kept constant only by the addition of water.
Bibliography:Application Number: JP20000341092