HEAT TREATMENT JIG COMPRISING SiC

• Main Authors: OGURA SHIGERU, KINOSHITA TOSHIHARU
• Format: Patent
• Language: English
• Published: 14.05.2002
• Edition: 7
• Subjects: ARTIFICIAL STONE; BASIC ELECTRIC ELEMENTS; CEMENTS; CERAMICS; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; LIME, MAGNESIA; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METALLURGY; MINERAL OR SLAG WOOL; REFRACTORIES; SEMICONDUCTOR DEVICES; SLAG; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; TREATMENT OF NATURAL STONE

PROBLEM TO BE SOLVED: To provide a heat treatment jig having suitable thermal expansion coefficient to be able to control the warping of the jig itself with the lapse of time and the glass plate deformation by the friction during the heat treatment, and having excellent thermal conductivity to conduct the uniform heat treatment of the glass plate in a comparatively short time, and improving the treatment for mounting or removing of the glass plate. SOLUTION: When the glass plate on which the film is formed to have a specified function is heat-treated, the heat treatment jig is used for the mounting of the glass plate. The jig comprising the SiC phase of 50 wt.% or more. The thermal conductivity of the jig is 10 W/mK or more, the apparent porosity is 0.2-25% and the thermal expansion coefficient is 3.8×10-6/ deg.C-5.5×10-6/ deg.C.