OPTICAL MODULE

PROBLEM TO BE SOLVED: To obtain an inexpensive optical module by reducing the occurrence of optical coupling defects by suppressing the change of an optical element in position, height, and levelness when solder is melted at the time of mounting the optical element by passive alignment. SOLUTION: Ei...

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Bibliographic Details
Main Authors HATA SHOHEI, KAWAMOTO KAZUTAMI
Format Patent
LanguageEnglish
Published 12.04.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To obtain an inexpensive optical module by reducing the occurrence of optical coupling defects by suppressing the change of an optical element in position, height, and levelness when solder is melted at the time of mounting the optical element by passive alignment. SOLUTION: Either or both of a substrate and the optical element has a solder film formed on metallized part of an electrode and a connecting structure which fixes the optical element and substrate by temporarily connecting the element and substrate to each other through a bump for temporary connection separately from the solder film. The connecting structure connects the substrate to the optical element by melting the solder of the solder film by heating the film to a temperature higher than the melting point of the solder. Since the bump is temporarily connected to metallized part of an optical element, the position, height, and levelness of the optical element do not change at the time of melting the solder.
Bibliography:Application Number: JP20000300557