EXCIMER LASER AND SILICON MATERIAL CUTTING DEVICE

• Main Authors: SUGAWA SHIGETOSHI, OMI TADAHIRO, SHINOHARA HISAKUNI, TAKEHISA KIWAMU
• Format: Patent
• Language: English
• Published: 05.04.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide an excimer laser, which can cut a silicon material in a narrow cutting width, and to provide a silicon material cutting device using this excimer laser. SOLUTION: An excimer laser is provided with a microwave generator 12 for exciting a laser medium by irradiating mi...