EXCIMER LASER AND SILICON MATERIAL CUTTING DEVICE

PROBLEM TO BE SOLVED: To provide an excimer laser, which can cut a silicon material in a narrow cutting width, and to provide a silicon material cutting device using this excimer laser. SOLUTION: An excimer laser is provided with a microwave generator 12 for exciting a laser medium by irradiating mi...

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Bibliographic Details
Main Authors SUGAWA SHIGETOSHI, OMI TADAHIRO, SHINOHARA HISAKUNI, TAKEHISA KIWAMU
Format Patent
LanguageEnglish
Published 05.04.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide an excimer laser, which can cut a silicon material in a narrow cutting width, and to provide a silicon material cutting device using this excimer laser. SOLUTION: An excimer laser is provided with a microwave generator 12 for exciting a laser medium by irradiating microwaves 30, resonators 6 and 8 arranged before and behind the laser medium, a Q switch 28, which is arranged between either of the resonators 6 and 8 and the laser medium and makes a laser beam 11A cause a pulse oscillation, a pulse compressor 31 for compressing the pulse width of the laser beam 11A and a condensing lens 24 for condensing the laser beam 11A of a compressed pulse width.
Bibliography:Application Number: JP20000291438