WIRE BONDING EQUIPMENT AND METHOD FOR MANUFACTURING ELECTRICAL COMPONENT

PROBLEM TO BE SOLVED: To provide a wire bonding equipment which can surely bond a ball formed on the tip of a wire to the electrode of a semiconductor chip. SOLUTION: The wire bonding equipment bonds a ball 7a formed on the tip of a wire 7 to the electrode of the semiconductor chip 9 by driving a bo...

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Bibliographic Details
Main Authors SUEMATSU MUTSUMI, OTANI KAZUMI
Format Patent
LanguageEnglish
Published 15.03.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a wire bonding equipment which can surely bond a ball formed on the tip of a wire to the electrode of a semiconductor chip. SOLUTION: The wire bonding equipment bonds a ball 7a formed on the tip of a wire 7 to the electrode of the semiconductor chip 9 by driving a bonding tool 4b in a driving target direction. The wire bonding equipment is equipped with a laser displacement gauge 14 which detects the height of the place where the wire of the semiconductor chip is to be bonded, and a control equipment 21 which bonds the ball to the electrode by controlling the drive in the drive target direction of the bonding tool according to the detection signal from the laser displacement gauge 14.
Bibliography:Application Number: JP20000262943