HOLDING MEMBER FOR POLISHING

PROBLEM TO BE SOLVED: To provide a holding member for polishing capable of more suitably polishing a silicon wafer or the like at its outer periphery than usual. SOLUTION: The holding member for polishing comprises a wafer holding member 2, an adhesive member 3 to a polishing machine and an interven...

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Bibliographic Details
Main Authors KAWABATA KATSUMASA, TSUTSUI HIROMASA, ISHII HIDEYUKI, BUN MINETAKE
Format Patent
LanguageEnglish
Published 19.02.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a holding member for polishing capable of more suitably polishing a silicon wafer or the like at its outer periphery than usual. SOLUTION: The holding member for polishing comprises a wafer holding member 2, an adhesive member 3 to a polishing machine and an intervened member 4 bonded therebetween. The thickness of the intervened member 4 allows the wafer holding member 2 to be lifted up at its outer periphery.
Bibliography:Application Number: JP20000242243