ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an electronic component which can prevent peeling of a lead terminal from the bottom plate of an enclosure form case as well as is capable of deal with the miniaturization of the electronic devices. SOLUTION: An electronic component which is composed of a resin made...

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Bibliographic Details
Main Authors OGATA KAZUHIRO, HATA YUJI
Format Patent
LanguageEnglish
Published 15.02.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an electronic component which can prevent peeling of a lead terminal from the bottom plate of an enclosure form case as well as is capable of deal with the miniaturization of the electronic devices. SOLUTION: An electronic component which is composed of a resin made enclosure form case 1 with a bottom plate 3 and a sidewall 5 and opened at the top and housing an electronic device A, and a plurality of belt form lead terminals 7a attached by integral molding to the lower side of the plate 3 of the case 1. A bonding reinforcement part 7b is formed on each facing side of the terminal 7a of both ends, and a tip part 7c of the part 7b is derived to the upper side of the plate 3 and is connected electrically to the device A.
Bibliography:Application Number: JP20000231744