STENCIL MASK AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To obtain a mask, in which an isolated pattern is surrounded by an opening pattern in a stencil mask. SOLUTION: A method for manufacturing the stencil mark comprises the steps of selectively retaining an insulating film part of an SOI wafer of a material of the mask, to incorpo...

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Bibliographic Details
Main Author KOJIMA YOSHINORI
Format Patent
LanguageEnglish
Published 15.02.2002
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To obtain a mask, in which an isolated pattern is surrounded by an opening pattern in a stencil mask. SOLUTION: A method for manufacturing the stencil mark comprises the steps of selectively retaining an insulating film part of an SOI wafer of a material of the mask, to incorporate a role of a beam for holding a shielding pattern surrounded in the opening pattern, and forming a pattern on the stencil mask such that a shape of the pattern is floating in the air.
Bibliography:Application Number: JP20000236092