NEW PHOTOSENSITIVE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for alkali developable DFR which retains flexibility of a cured film and adhesion to a substrate and has satisfactory plating resistance. SOLUTION: The photosensitive resin composition contains (A) a photopolymerizable unsaturated c...

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Bibliographic Details
Main Authors KAWAMATA TAIGA, KOMIYA KAORU
Format Patent
LanguageEnglish
Published 31.01.2002
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for alkali developable DFR which retains flexibility of a cured film and adhesion to a substrate and has satisfactory plating resistance. SOLUTION: The photosensitive resin composition contains (A) a photopolymerizable unsaturated compound, (B) a binder polymer having a carboxyl group and (C) a photopolymerization initiator. The component (A) contains a compound of the formula CH2=CR-CO-O-(AO)a-(EO)b-(AO)c-CO-CR'= CH2 (where R and R' are each H or methyl; (a), (b) and (c) are each a number of 1-30; EO is oxyethylene, and (AO)a and (AO)c are each a polyoxyalkylene chain obtained by polymerizing a >=3C alkylene oxide(AO) or copolymerizing EO and >=3C AO) as an essential component. A photosensitive element obtained by applying and drying the photosensitive resin on a substrate is provided.
Bibliography:Application Number: JP20000215767