HEAT CONDUCTION CONTROL MECHANISM

PROBLEM TO BE SOLVED: To provide heat conduction control mechanism capable of suppressing fluctuation in the consumption power of a variety of electronic apparatuses or temperature fluctuation in an electronic apparatus which is caused by temperature fluctuation of installation environment. SOLUTION...

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Bibliographic Details
Main Author YABE NORIO
Format Patent
LanguageEnglish
Published 25.01.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide heat conduction control mechanism capable of suppressing fluctuation in the consumption power of a variety of electronic apparatuses or temperature fluctuation in an electronic apparatus which is caused by temperature fluctuation of installation environment. SOLUTION: In the heat conduction control mechanism, heat generated from a heat generating part of an apparatus is conducted to a heat dissipating part via a heat conducting path and dissipated from the heat dissipating part. A first and a second radiating surface which face each other are arranged in the heat conducting path. Material whose emissivity has positive temperature characteristic to a temperature is stuck on the first and the second radiating surfaces, or the radiating surfaces are subjected to surface treatment using the material.
Bibliography:Application Number: JP20000210659