METHOD FOR PRODUCING LEAD FRAME FIXING TAPE, AND METHOD FOR TAPING LEAD FRAME
PROBLEM TO BE SOLVED: To provide a method for producing a lead frame fixing tape, and a corresponding method for taping a lead frame, in which the fixing tape is not deformed during punching and an initially punched part is not wasted as it is when it is large. SOLUTION: In the method for forming a...
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| Main Authors | , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
26.12.2001
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| Edition | 7 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | PROBLEM TO BE SOLVED: To provide a method for producing a lead frame fixing tape, and a corresponding method for taping a lead frame, in which the fixing tape is not deformed during punching and an initially punched part is not wasted as it is when it is large. SOLUTION: In the method for forming a frame-like fixing tape being attached to a specified position of the inner lead of a lead frame in order to secure the inner lead, a small size frame-like fixing tape is punched from a stripe fixing tape material stretched substantially horizontally. Subsequently, a large size frame-like fixing tape is punched to include the region of the fixing tape material where the small size frame-like fixing tape is punched. |
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| AbstractList | PROBLEM TO BE SOLVED: To provide a method for producing a lead frame fixing tape, and a corresponding method for taping a lead frame, in which the fixing tape is not deformed during punching and an initially punched part is not wasted as it is when it is large. SOLUTION: In the method for forming a frame-like fixing tape being attached to a specified position of the inner lead of a lead frame in order to secure the inner lead, a small size frame-like fixing tape is punched from a stripe fixing tape material stretched substantially horizontally. Subsequently, a large size frame-like fixing tape is punched to include the region of the fixing tape material where the small size frame-like fixing tape is punched. |
| Author | TANAKA HITOSHI BABA SUSUMU |
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| Notes | Application Number: JP20000177698 |
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| RelatedCompanies | DAINIPPON PRINTING CO LTD |
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| Snippet | PROBLEM TO BE SOLVED: To provide a method for producing a lead frame fixing tape, and a corresponding method for taping a lead frame, in which the fixing tape... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | METHOD FOR PRODUCING LEAD FRAME FIXING TAPE, AND METHOD FOR TAPING LEAD FRAME |
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