METHOD FOR PRODUCING LEAD FRAME FIXING TAPE, AND METHOD FOR TAPING LEAD FRAME

PROBLEM TO BE SOLVED: To provide a method for producing a lead frame fixing tape, and a corresponding method for taping a lead frame, in which the fixing tape is not deformed during punching and an initially punched part is not wasted as it is when it is large. SOLUTION: In the method for forming a...

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Bibliographic Details
Main Authors BABA SUSUMU, TANAKA HITOSHI
Format Patent
LanguageEnglish
Published 26.12.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method for producing a lead frame fixing tape, and a corresponding method for taping a lead frame, in which the fixing tape is not deformed during punching and an initially punched part is not wasted as it is when it is large. SOLUTION: In the method for forming a frame-like fixing tape being attached to a specified position of the inner lead of a lead frame in order to secure the inner lead, a small size frame-like fixing tape is punched from a stripe fixing tape material stretched substantially horizontally. Subsequently, a large size frame-like fixing tape is punched to include the region of the fixing tape material where the small size frame-like fixing tape is punched.
Bibliography:Application Number: JP20000177698