MODULE-TYPE SEMICONDUCTOR DEVICE AND ITS METHOD

• Main Authors: ISHIWATARI YUTAKA, KIJIMA KENJI, TANAKA AKIRA, ANDO HIDEYASU, YAMAMOTO ATSUSHI, SHINDOU TAKAHIKO
• Format: Patent
• Language: English
• Published: 14.12.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To extend the thermal fatigue life of a soldering layer, and at the same time to improve the cooling characteristics of a semiconductor chip. SOLUTION: A high-toughness region 21 is metallurgically joined to a low thermal expansion region 22, thus extending the thermal fatigue life of a soldering layer 5b by the low thermal expansion region 22, and improving the cooling characteristics of a semiconductor chip 4 by the high toughness region 21. In addition, the junction surface between the regions 21 and 22 is joined at a specific angle θto a plate-thickness direction, thus relieving the concentration of thermal stress on the junction surface between the low thermal expansion and high-toughness regions 22 and 21 caused by the thermal stress, and preventing the damage of a base 20 due to the thermal stress.