POLYPROPYLENE RESIN COMPOSITION FOR EXTRUSION LAMINATION
PROBLEM TO BE SOLVED: To provide a polypropylene resin composition for extrusion lamination which is excellent in low-temperature heat sealability on a laminate substrate, balance between stiffness and sealability, and high-speed moldability. SOLUTION: This polypropylene resin composition comprises...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
20.11.2001
|
Edition | 7 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PROBLEM TO BE SOLVED: To provide a polypropylene resin composition for extrusion lamination which is excellent in low-temperature heat sealability on a laminate substrate, balance between stiffness and sealability, and high-speed moldability. SOLUTION: This polypropylene resin composition comprises (A) 80-90 wt.% propylene-ethylene random copolymer having specified melting peak temperature, melting completion temperature, amount of o-dichlorobenzene extract, Mw/Mn, and ethylene content, (B) 3-15 wt.% low-density polyethylene, and (C) 3-10 wt.% ethylene-α-olefin copolymer having specified MFR and density. |
---|---|
Bibliography: | Application Number: JP20000139746 |