POLYPROPYLENE RESIN COMPOSITION FOR EXTRUSION LAMINATION

PROBLEM TO BE SOLVED: To provide a polypropylene resin composition for extrusion lamination which is excellent in low-temperature heat sealability on a laminate substrate, balance between stiffness and sealability, and high-speed moldability. SOLUTION: This polypropylene resin composition comprises...

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Bibliographic Details
Main Authors ISHIHARA TOSHIHISA, YAMASHITA TAKASHI
Format Patent
LanguageEnglish
Published 20.11.2001
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide a polypropylene resin composition for extrusion lamination which is excellent in low-temperature heat sealability on a laminate substrate, balance between stiffness and sealability, and high-speed moldability. SOLUTION: This polypropylene resin composition comprises (A) 80-90 wt.% propylene-ethylene random copolymer having specified melting peak temperature, melting completion temperature, amount of o-dichlorobenzene extract, Mw/Mn, and ethylene content, (B) 3-15 wt.% low-density polyethylene, and (C) 3-10 wt.% ethylene-α-olefin copolymer having specified MFR and density.
Bibliography:Application Number: JP20000139746