ALIGNMENT-MARK POSITION MEASURING METHOD, PATTERN EXPOSURE SYSTEM, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING PLANT, AND PATTERN EXPOSURE SYSTEM MAINTAINING METHOD

PROBLEM TO BE SOLVED: To immediately remove a measurement result or to measure an alternative position when an error measurement occurs or a predetermined measuring accuracy deteriorates. SOLUTION: In an alignment mark position measuring method for sequentially measuring positions of a plurality of...

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Bibliographic Details
Main Author KOGA SHINICHIRO
Format Patent
LanguageEnglish
Published 16.11.2001
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
CONTROLLING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
REGULATING
SEMICONDUCTOR DEVICES
SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
TESTING
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Summary:PROBLEM TO BE SOLVED: To immediately remove a measurement result or to measure an alternative position when an error measurement occurs or a predetermined measuring accuracy deteriorates. SOLUTION: In an alignment mark position measuring method for sequentially measuring positions of a plurality of alignment marks on an object necessary for aligning the object, every time the positions of one or a predetermined number of alignment marks are measured (step S3), an error measurement or the presence or absence of deterioration of a predetermined measuring accuracy is detected (step S9).
Bibliography:Application Number: JP20000136221