SHIELD SUBSTRATE AND METHOD FOR MOUNTING THE SAME AND ELECTRONICS USING THE SAME

PROBLEM TO BE SOLVED: To achieve sufficient noise countermeasures, to reduce the number of components for carrying out conduction by laminating a shield member closely to a circuit board, and to reduce costs by simplifying the assembly working process. SOLUTION: This shield substrate is provided wit...

Full description

Saved in:
Bibliographic Details
Main Author EMOTO KENGO
Format Patent
LanguageEnglish
Published 09.11.2001
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To achieve sufficient noise countermeasures, to reduce the number of components for carrying out conduction by laminating a shield member closely to a circuit board, and to reduce costs by simplifying the assembly working process. SOLUTION: This shield substrate is provided with a shield member 10 formed by laminating a first conductive layer 12 constituted of a copper foil or the like and an insulating layer 11 constituted of epoxy resin or the like, an electronic circuit board 5 formed by laminating a second conductive layer 7 constituted of a copper foil pattern on a substrate 6 constituted of a flexible polyimide resin substrate, and an extended part 14 from the edge of the first conductive layer 12 of the substrata 6. In this case, a ground site G is formed at a position faced to the extended part 14, and the extended part and the ground site are maintained so as to be butted to each other so that conduction can be carried out.
Bibliography:Application Number: JP20000128511