METHOD OF FORMING CLEAVED GROOVE AND DEVICE FOR FORMING CLEAVED GROOVE

PROBLEM TO BE SOLVED: To form a groove leaving a predetermined thickness regardless the material of a work. SOLUTION: When a groove is formed with a cutting-in means 10 from the back side of an instrument panel 1 which is a work on whose surface a recessed part is formed, a distance sensor 20 measur...

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Bibliographic Details
Main Authors HORII HIROYUKI, SAKAMOTO HIDEAKI, MORITA YUICHI
Format Patent
LanguageEnglish
Published 30.10.2001
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To form a groove leaving a predetermined thickness regardless the material of a work. SOLUTION: When a groove is formed with a cutting-in means 10 from the back side of an instrument panel 1 which is a work on whose surface a recessed part is formed, a distance sensor 20 measures the distance from the front surface side of the panel 1 to the front surface of the panel 1. The output of a laser beam L is controlled corresponding to the measured result by the distance sensor 20, and the groove is formed on the front surface side of the panel 1 with the laser beam L leaving a predetermined thickness.
Bibliography:Application Number: JP20000119312