METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD USING IT

• Main Authors: KOJIMA TOSHIFUMI, SUMI YASUSHI, OKUYAMA MASAHIKO
• Format: Patent
• Language: English
• Published: 26.10.2001
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a printed wiring board where the sagging of paste from the opening face of a through hole caused by the drop of viscosity of the paste occurring at heat treatment of the hole stopping paste filled in a through hole and the occurrence of indentation of the through hol...