METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD USING IT

PROBLEM TO BE SOLVED: To provide a printed wiring board where the sagging of paste from the opening face of a through hole caused by the drop of viscosity of the paste occurring at heat treatment of the hole stopping paste filled in a through hole and the occurrence of indentation of the through hol...

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Bibliographic Details
Main Authors KOJIMA TOSHIFUMI, SUMI YASUSHI, OKUYAMA MASAHIKO
Format Patent
LanguageEnglish
Published 26.10.2001
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a printed wiring board where the sagging of paste from the opening face of a through hole caused by the drop of viscosity of the paste occurring at heat treatment of the hole stopping paste filled in a through hole and the occurrence of indentation of the through hole opening face accompanying it are prevented, and its manufacturing method. SOLUTION: A mask for stopping a hole which has a through hole made in a position corresponding to a through hole is placed on a substrate, and hole stopping paste whose viscosity at 22-23 deg.C is 300 Pa.s or over is press-filled in a through hole through a through hole from above the hole stopping mask, using a roller type of squeeze.
Bibliography:Application Number: JP20010026075