SEMICONDUCTOR SEALING RESIN, AND METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor element sealing resin comprising fluidity suitable for molding and excellent mechanical strength after molding, related to a semiconductor device and its manufacturing method. SOLUTION: The sealing resin comprises a silanol radical of 0.001-10 mmol/g...

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Bibliographic Details
Main Authors KAWAHARA TOSHISANE, TAKIGAWA YUKIO
Format Patent
LanguageEnglish
Published 14.09.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor element sealing resin comprising fluidity suitable for molding and excellent mechanical strength after molding, related to a semiconductor device and its manufacturing method. SOLUTION: The sealing resin comprises a silanol radical of 0.001-10 mmol/g on its surface and silica powder whose particle size is 0.01-200 μm.
Bibliography:Application Number: JP20000059450