ECR SPUTTER FILM FORMING APPARATUS
PROBLEM TO BE SOLVED: To provide an ECR sputter film forming apparatus which can form a film of a uniform thickness on a plate. SOLUTION: The film is formed by oscillating an ECR sputter source S having a target, a coil and a plasma chamber so that the central axis 7a of the target follows a circumf...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
14.09.2001
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide an ECR sputter film forming apparatus which can form a film of a uniform thickness on a plate. SOLUTION: The film is formed by oscillating an ECR sputter source S having a target, a coil and a plasma chamber so that the central axis 7a of the target follows a circumference L having a predetermined radius from a center of an HD substrate 1. As a result, the film thickness on a circumferential portion of the substrate 1 can be substantially same as that on a center portion, and the film thickness distribution can be uniform. |
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Bibliography: | Application Number: JP20000059201 |