SURFACE-MOUNTED INTEGRATED CIRCUIT ELEMENT AND PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To suppress electromagnetic noise radiated from a surface-mounted integrated circuit element(IC) and a printed circuit board. SOLUTION: A metal plate 16 is fitted onto mold resin 15 on the top surface of the IC 10A. The metal plate 16 is composed of an earth plate 16a which cov...

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Bibliographic Details
Main Author FUTAMURA KAZUNORI
Format Patent
LanguageEnglish
Published 07.09.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To suppress electromagnetic noise radiated from a surface-mounted integrated circuit element(IC) and a printed circuit board. SOLUTION: A metal plate 16 is fitted onto mold resin 15 on the top surface of the IC 10A. The metal plate 16 is composed of an earth plate 16a which covers the mold resin 15, and earth leads 16b provided at the periphery of the earth plate 16a. The earth leads 16b are so shaped that they are connected to the reference potential (earth) pad of the printed circuit board. Part of the current of a return path which flows to the earth layer in the printed board flows to the earth plate 16a, so the current path becomes shorter than that of a conventional IC having no earth plate, thereby suppressing the radiation of electromagnetic noise.
Bibliography:Application Number: JP20000049375