PAD CONDITIONER FOR CMP

PROBLEM TO BE SOLVED: To provide such a pad conditioner for CMP device used in semiconductor substrate machining that prevents the drop of diamond abrasive grain and contamination of a silicone wafer due to elution of binder and a base metal unit. SOLUTION: This pad conditioner for CMP is constitute...

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Bibliographic Details
Main Authors KADOMURA KAZUNORI, ASAHINO HAJIME, FUKUSHIMA KENJI
Format Patent
LanguageEnglish
Published 04.09.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide such a pad conditioner for CMP device used in semiconductor substrate machining that prevents the drop of diamond abrasive grain and contamination of a silicone wafer due to elution of binder and a base metal unit. SOLUTION: This pad conditioner for CMP is constituted by fixing diamond abrasive grains having average particle diameter of 30 μm to 1000 μm in a single layer on a surface of the base metal unit by nickel plating or binder having a wax material as a main component to cover a surface of the binder or both of the surfaces of the binder and base metal unit with an ultrathin film laminated film in which TiN films and CrN films are alternately laminated.
Bibliography:Application Number: JP20000052665