METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT AND APPARATUS FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide method and apparatus for manufacturing a semiconductor element inexpensively while facilitating automation. SOLUTION: Electrical connection between the bumps 2 of a semiconductor element 1 and the pads on a mounting board utilizes shrinking force of a resin film 3, s...

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Bibliographic Details
Main Author MURAKAMI ASAO
Format Patent
LanguageEnglish
Published 31.08.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide method and apparatus for manufacturing a semiconductor element inexpensively while facilitating automation. SOLUTION: Electrical connection between the bumps 2 of a semiconductor element 1 and the pads on a mounting board utilizes shrinking force of a resin film 3, sandwiched between the semiconductor element and the mounting board, at the time of curing. The bumps 2 are formed collectively as the electrodes of respective semiconductor elements on a wafer 10 which is then bonded temporarily with the resin film 3 by vacuum lamination before being diced into individual elements. Cost can be reduced significantly as compared with a conventional method where bumps are formed on individual semiconductor elements and a resin film is fed onto the mounting board while matching the size for each semiconductor element at the time of mounting.
Bibliography:Application Number: JP20000044692