CURING AGENT FOR EPOXY RESIN AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To obtain a highly safe method for manufacturing a cresol-novolak resin capable of synthesizing a cresol novolak resin having a high molecular weight and a molecular weight distribution within a narrow range in an extremely short time without using an organic solvent and also p...

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Bibliographic Details
Main Authors OOYABE TAKASHI, ISHIMOTO KOJI, SHIOMI KAZUYOSHI, KATAYAMA TSUNEO, KONDO KOICHI
Format Patent
LanguageEnglish
Published 28.08.2001
Edition7
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
CORRECTING FLUIDS
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILLING PASTES
INKS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:PROBLEM TO BE SOLVED: To obtain a highly safe method for manufacturing a cresol-novolak resin capable of synthesizing a cresol novolak resin having a high molecular weight and a molecular weight distribution within a narrow range in an extremely short time without using an organic solvent and also permitting synthesis at a relatively low temperature even when an organic solvent is employed. SOLUTION: A method for synthesizing a cresol novolak resin having a high molecular weight and free from a gelled matter comprises heating ortho- cresol and trioxane in the presence of chlorosilane thereby effecting polycondensation.
Bibliography:Application Number: JP20000047200