METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

• Main Author: YAMATE YUUKI
• Format: Patent
• Language: English
• Published: 24.08.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To improve a contact property between a connecting terminal of a member for supporting a semiconductor device and a lead of the semiconductor device. SOLUTION: There are provided a tab 1e for supporting a semiconductor chip 2 having a semiconductor integrated circuit formed on its main surface, a plurality of leads 1a that are disposed in the periphery of the tab 1e and provided with a terminal connecting surface 1b exposed in the outer periphery of the rear surface 3a of a sealed portion 3, the sealed portion formed by sealing the semiconductor chip and bonding wires for connecting pads of the semiconductor chip 2 and leads 1a corresponding to them. Since the plurality of leads 1a disposed in the outer periphery of the rear surface 3a of the sealed portion 3 are provided while inclined in a direction perpendicular to their array direction, a CSP 7 can be reliably brought into contact with a mount board or a connecting terminal of a socket when the CSP 7 is mounted on the mount board or the socket. As a result, the contact property of the CSP 7 can be improved.