HEAT DISSIPATION MEMBER

PROBLEM TO BE SOLVED: To provide a heat dissipation member which is excellent in balance between thermal conductivity and hydrolysis resistance. SOLUTION: The heat dissipation member for a heat-generating electronic component is a molded body which is made of 50 volume % or more of aluminum nitride...

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Bibliographic Details
Main Authors ITABASHI YASUHIKO, KAWASAKI TAKU, OTSUKA TETSUMI
Format Patent
LanguageEnglish
Published 24.08.2001
Edition7
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:PROBLEM TO BE SOLVED: To provide a heat dissipation member which is excellent in balance between thermal conductivity and hydrolysis resistance. SOLUTION: The heat dissipation member for a heat-generating electronic component is a molded body which is made of 50 volume % or more of aluminum nitride power filled in silicone hardened material and which has a thermal conductivity of 5 W/m.K or more. The aluminum nitride power contains 90% or more of particles having a grain size of less than 150 μm and has a volume ratio of 0.5-1.5 of particles of 45-150 μm to particles of less than 45 μm.
Bibliography:Application Number: JP20000039011