SHEET FOR EXECUTING HEAT-INSULATING FLOOR AND HEAT- INSULATING FLOORING

• Main Authors: NAKAMURA RUNA, SATO KIMIHARU, ITO ARIMICHI, NAGATA RYOHEI, SUDO KENICHIRO, YOKOYAMA SUKEYOSHI
• Format: Patent
• Language: English
• Published: 17.08.2001
• Edition: 7
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BUILDING; CEILINGS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS; FIXED CONSTRUCTIONS; FLOORS; GENERAL BUILDING CONSTRUCTIONS; GENERAL PROCESSES OF COMPOUNDING; INSULATION OR OTHER PROTECTION OF BUILDINGS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; ROOFS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; WALLS, e.g. PARTITIONS; WORKING-UP

PROBLEM TO BE SOLVED: To provide a sheet for executing a heat-insulating floor proper to underlaying for improving heat-insulating properties prior to application to the floor of various floor finishes, and to provide a heat-insulating flooring in which heat-insulating properties are improved. SOLUTION: An non-slip layer 4 is laminated preferably on the underside of a heat-insulating sheet 11 composed of a resin composition including hollow grains and/or bubbles and an adhesive layer 2 and a peelable sheet 3 are laminated on a top face in order, and the laminate is used for the underlaying of the flooring or such a heat-insulating sheet 11 is stuck previously on the rear of the flooring 6 through the adhesive layer 2, thus solving the above-mentioned problem.