CHIP SUPPORT BOARD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING IT, AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a chip support board for a semiconductor package, a semiconductor package using it, and its manufacturing method of less deflection, excellent in external connection reliability. SOLUTION: An insulating support board comprising at least three layers, namely a first l...

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Bibliographic Details
Main Authors TSUBOMATSU YOSHIAKI, IWASAKI YORIO, INOUE FUMIO, OHATA HIROTO, AWANO YASUHIKO
Format Patent
LanguageEnglish
Published 10.08.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a chip support board for a semiconductor package, a semiconductor package using it, and its manufacturing method of less deflection, excellent in external connection reliability. SOLUTION: An insulating support board comprising at least three layers, namely a first layer, a second layer, and a third layer starting on the side where a metal wiring is formed, is provided. With thicknesses and thermal expansion factors of the layers as (T1, α1), (T2, α2), (T3, α3) in order, (T1/T2) as well as (T3/T2)<; 0.5, while (α1/α2) as well as (α3/α2)<10.
Bibliography:Application Number: JP20000027173