ANISOTROPIC CONDUCTIVE FILM

PROBLEM TO BE SOLVED: To provide an anisotropic conductive film that is good in electrical property and in adhesive force due to good heat resistance, and thus exhibits high adhesive force in even polyimides of non-electrode surface of two layers of a flexible printed circuit board of free adhesive...

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Bibliographic Details
Main Authors MORIMURA YASUHIRO, MIURA TERUO, SAKURAI MAKOTO, OKADA TOKUO, HIRAOKA HIDETOSHI
Format Patent
LanguageEnglish
Published 27.07.2001
Edition7
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
CONDUCTORS
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
INSULATORS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide an anisotropic conductive film that is good in electrical property and in adhesive force due to good heat resistance, and thus exhibits high adhesive force in even polyimides of non-electrode surface of two layers of a flexible printed circuit board of free adhesive type, resulting in good workability. SOLUTION: In this anisotropic conductive film, conductive particles are dispersed in an adhesive layer. The adhesive is a thermoset and light curing adhesive including a soluble polyester unsaturated compound in a solvent.
Bibliography:Application Number: JP20000011980