ELECTRON BEAM LITHOGRAPHY PROCESS

PROBLEM TO BE SOLVED: To provide an electron beam lithography process which is reduced in line width variation. SOLUTION: This invention relates to the field of electron beam lithography, particularly, to the shaped beam lithography which is used in an integrated circuit manufacturing process to for...

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Bibliographic Details
Main Authors HARTLEY JOHN G, MICHAEL S GORDON
Format Patent
LanguageEnglish
Published 22.06.2001
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an electron beam lithography process which is reduced in line width variation. SOLUTION: This invention relates to the field of electron beam lithography, particularly, to the shaped beam lithography which is used in an integrated circuit manufacturing process to form spots having variable shapes on a photoresist. The electron beam lithography process includes a step of generating an electron beam, and another step of introducing the electron beam through the first square aperture in a first lamina. The first square aperture has a first tooth-shaped edge section. In addition, the electron beam emitted from the first square aperture in the first lamina is focused on the second square lamina in a second lamina having a second tooth-shaped edge section. The formed spot has a quasi-resolution edge area which is formed at least partially by means of the first and second tooth-shaped edge sections.
Bibliography:Application Number: JP20000319983