FLIP CHIP AND ITS MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide a flip chip and its mounting method which enable rearrangement of an IC chip electrode position on a pad on a substrate so that various substrates can be subjected to flip chip mounting. SOLUTION: A flip chip has a frame 1 consisting of a die pad 3, frame part 2, and...

Full description

Saved in:
Bibliographic Details
Main Author NIIMI AKIHIRO
Format Patent
LanguageEnglish
Published 29.05.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a flip chip and its mounting method which enable rearrangement of an IC chip electrode position on a pad on a substrate so that various substrates can be subjected to flip chip mounting. SOLUTION: A flip chip has a frame 1 consisting of a die pad 3, frame part 2, and leads 4 extending from the die pad 3 to the frame part 2. An IC chip 8 is fixed on the die pad 3 of the fame 1 by an adhesive or the like: an Al pad 1 formed on the IC chip 8 is fitted with one end of an Au wire 6, and an Au land 13 located on a second electrode 12 of the substrate 10 is fitted with the other end of the Au wire 6.
Bibliography:Application Number: JP19990328272