METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, whereby if an antireflection film is removed by an etch back step, connection holes of adequate shapes can be formed by additionally forming a second antireflection film, to prevent the halation under question especia...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English |
Published |
25.05.2001
|
Edition | 7 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!