METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, whereby if an antireflection film is removed by an etch back step, connection holes of adequate shapes can be formed by additionally forming a second antireflection film, to prevent the halation under question especia...

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Bibliographic Details
Main Author MATSUMOTO KAZUHARU
Format Patent
LanguageEnglish
Published 25.05.2001
Edition7
Subjects
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