DRESSER AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a diamond dresser and its manufacturing method capable of performing dressiog of a polishing pad efficiently and involving no risk of slipping-off of diamond abrasive grains resulting from elusion of a binder nor of generating scratches at a wafer surface. SOLUTION:...

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Bibliographic Details
Main Authors TAKADA ATSUSHI, KADOMURA KAZUNORI
Format Patent
LanguageEnglish
Published 22.05.2001
Edition7
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a diamond dresser and its manufacturing method capable of performing dressiog of a polishing pad efficiently and involving no risk of slipping-off of diamond abrasive grains resulting from elusion of a binder nor of generating scratches at a wafer surface. SOLUTION: TiN or TiC is used as the main component of a binder for a super-abrasive grain layer. When this is used to diamond dresser for CMP, the TiN or TiC content should preferably be not less than, 90% because not only a grain retaining force but an anti-corrosion property is of important as the properties required of the binder.
Bibliography:Application Number: JP19990357870